Sharp Disney Mobile on docomo DM-01J LTE Full Specs Datasheet

Sharp Disney Mobile on docomo DM-01J LTE comes with 5 inches touch screen with 720 x 1280 pixels screen resolution and has 1400 MHz Qualcomm Snapdragon 430 MSM8937 Processor with 2GB RAM and 16GB ROM which is running on Android 6.0 Marshmallow Japanese Version. Also it comes with a 13MP Rear and 5MP front camera and Backed up with a battery of 2440 mAh. It was a quick overview for the main features Sharp Disney Mobile on docomo DM-01J LTE. Below you will find the Sharp Disney Mobile on docomo DM-01J LTE Full Specs Technical Datasheet which is a detailed datasheet containing all information you need to knew about the Sharp Disney Mobile on docomo DM-01J LTE Smartphone. Hope this datasheet helpful. Don't forget to help us by sharing this post with your friends.

Sharp Disney Mobile on docomo DM-01J LTE Full Specs Datasheet

Sharp Disney Mobile on docomo DM-01J LTE Detailed Technical Datasheet

General Attributes
Released:  2017 Feb
Announced:  2016 Oct
Hardware designerThe company which designed this device:  Sharp
ManufacturerThe company which produces this device:  Sharp
Device Category:  SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.
Additional Features:  capacitive display, multi-touch screen, HSDPA 14.4, HSUPA 5.76, LTE 150/50Mbps, DLNA, face detection, NFC, VoLTE, WiFi Mobile Hotspot, light sensor, proximity sensor, nano-SIM
Market CountriesCountries where the device was officially sold. Overlap is possible.:  Japan, South Korea

Physical Attributes
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation:  71 mm

2.8 inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation:  143 mm

5.63 inches
DepthDepth or thickness is usually the smallest dimension of the device:  8.3 mm

0.33 inches
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres:  84.3 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams:  130 g

4.59 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software Environment
Embedded Operating SystemPre-installed operating system which the device was released with.:  Google Android 6.0 (Marshmallow)

JapaneseSubversion, update version, user interface, defualt language, etc.

Application processor, Chipset
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate.:  1400 MHz
CPUManufacturer part number of the IC which includes the main application processor os processors:  Qualcomm Snapdragon 430 MSM8937, 2016, 64 bit, octa-core, 28 nm, Qualcomm Adreno 505 GPU

Operative Memory
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).:  mobile (LP) DDR3 SDRAM
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes):  2048 MiB RAM

Non-volatile Memory
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance:  Flash EEPROM
Non-volatile Memory CapacityCapacity of the primary non-volatile memory in mebibytes (binary megabytes) :  15259 MiB non-volatile

DisplayAll parameters that related to display
Display ResolutionHorizontal and vertical resolution of the primary display:  720x1280

921600 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display DiagonalThe distance measured between the furthest corners of the display:  127 mm

5 inch
Display WidthThe distance between the vertical edges of the display (horizontal display size):  62.26 mm

2.45 inch
Display HeightThe distance between the horizontal edges of the display (vertical Display Size):  110.69 mm

4.36 inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width.:  8.74 mm
Display AreaCalculated display area is the product of horizontal and vertical display sizes:  6891.9 square millimeter
Display Area UtilizationDisplay area per front panel area ratio:  68%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio:  0.08648 mm/px
Pixel DensityIndicates the number of pixels per inch:  294 PPI
Display TypeDisplay Type:  Color ASV TFT LCDColor ASV TFT (Axially Symmetric Vertical). This is an active matrix LCD technology developed by Sharp.
Display Color DepthColor depth defines how many colors or greyscales can be displayed:  24 bit/pixel
Number of Display Colors/ScalesMaximal number of displayable colors or scales:  16.8M
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.:  Yes
Display Light Reflection Mode:  Yes
Display Subpixel Scheme:  RGB Matrix (3 subpixels)Each pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant Screen:  No

Graphical Subsystem
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset:  Qualcomm Adreno 505

Audio/Video Interfaces
A/V OutBuilt-in Audio/Video outputs (A/V out) form a very heterogeneous group of interfaces that allow the user to connect the mobile device to various external analog/digital multimedia devices (monitors, projectors, TVs, HD TVs) and play multimedia content.:  No

Audio Subsystem
Audio Channel(s):  stereo

Sound Recording
Microphone(s):  mono

Sound Playing
Audio Output:  3.5mm
LoudSpeaker(s):  mono

Cellular Phone
Supported Cellular NetworksList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.:  GSM 850MHzGSM850 phones support GSM 850 MHz band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM 900MHzGSM900 phones support P-GSM (Primary GSM) 900 MHz band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM 1800MHzGSM1800 phones support GSM / DCS / PCS 1800 MHz band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz)., GSM 1900MHz (PCS)GSM1900 phones support PCS 1900 MHz band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz) , UMTS 800MHz (Band VI)UMTS800 phones support UMTS 800 MHz (UMTS Band 6) band (downlink: 875 - 885 MHz, uplink: 830-840 MHz), UMTS 850MHz (Band V, CLR)UMTS850 phones support UMTS 850 MHz (CLR, also refferred as UMTS Band V) band (downlink: 871.4 - 891.6 MHz, uplink: 826.4 - 846.6 MHz), UMTS 2100MHz (Band I, IMT)UMTS2100 phones support UMTS 1900 / 2100MHz (IMT, also refferred as UMTS Band I) band (downlink: 2112.4 - 2167.6 MHz, uplink: 1922.4-1977.6 MHz), UMTS 800MHz (Band XIX)UMTS800 phones support UMTS 800 MHz (UMTS Band 6) band (downlink: 877.4 - 887.6 MHz, uplink: 832.4-842.6 MHz), LTE 2100 MHz (Band 1)LTE2100 phones support LTE 1900 / 2100MHz (IMT, also refferred as LTE Band 1) band (downlink: 2110 - 2170 MHz, uplink: 1920 - 1980 MHz), LTE 850 MHz (Band 5)LTE850 phones support LTE 850 MHz (LTE Band 5) band (downlink: 869 - 894 MHz, uplink: 824 - 849 MHz), LTE 1800 MHz (Band 3)LTE1800 phones support LTE 1800 MHz (LTE Band 3) band (downlink: 1805 - 1880 MHz, uplink: 1710 - 1785 MHz), LTE 800 MHz (Band 19)LTE800 phones support LTE 800 MHz (LTE Band 19) band (downlink: 875 - 890 MHz, uplink: 830 - 845 MHz)
Supported Cellular Data LinksList of supported cellular data links and rates.:  GPRS (Class unspecified)General Packet Radio Service, EDGE (Class unspecified)Enhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS), UMTS 384 kbps (W-CDMA)Universal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed., HSDPA (Cat. unspecified)High-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol., HSDPA 14.4 Mbps (Cat. 10), HSPA+ 21.1 Mbps (Cat. 18), HSUPA (Cat. unspecified)High-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol., HSUPA 5.76 Mbps (Cat. 6), LTE (Cat. unspecified)LTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS)., LTE 150 Mbps / 50 Mbps (Cat. 4)LTE 151.2 Mbps / 50.4 Mbps (Cat. 4)
SIM Card FormatSupported Subscriber Identification Card (SIM) Format:  Nano-SIM (4FF)
Cellular Antenna:  Internal antenna
Call Alert SoundPolyphonic or monophonic call alert sound (number of chords):  128-chord melody
Complementary Phone Services:  Voice transmissionDevice is able to receive and transmit voice over cellular network, Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice., Vibrating Alert, Speakerphone, Voice over LTE (VoLTE)
Cellular Controller / Modem ICManufacturer part number of the cellular modem and controller IC or commercial name of the intellectual property (IP) if the function is the part of a chipset:  Qualcomm MSM8937

Secondary Cellular Phone
Sec. Supported Cellular Networks:  No

Control Peripherals
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen:  Capacitive multi-touch sensing
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect:  Yes

Communication Interfaces
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces:  microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB., TransFlash, microSD Extended CapacityA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBUSB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.:  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Speed Rate:  USB Hi-Speed (480 Mbps)
USB Services:  USB chargingThe device is able to charge its battery supplied from the USB port.
USB Connector:  USB Series Micro-AB
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers.:  Bluetooth 4.2From Dec, 2014

Internal antenna
Bluetooth profiles:  Advanced Audio Distribution Profile (A2DP), Audio/Video Remote Control Profile (AVRCP)
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer:  IEEE 802.11b, IEEE 802.11g, IEEE 802.11n
Wireless Services:  Wi-Fi TetheringWi-Fi Mobile Hotsport

Internal antenna
NFCNear Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID).:  ISO/IEC 14443 Type A, ISO/IEC 14443 Type B

Multimedia Broadcast
Analog Radio Receiver:  No

Satellite Navigation
Supported GPS protocol(s):  NMEA 0183
GPS Antenna:  Internal antenna
Complementary GPS Services:  Assisted GPS, QuickGPS, Geotagging, Simultaneous GPS (S-GPS)
Navigation ControllerManufacturer part number of the GNSS (GPS, GLONASS, Galileo and/or BDS) controller IC or commercial name of the intellectual property (IP) if the controller is the part of a chipset:  Qualcomm MSM8937

Built-in Digital CameraPrimary camera usually has better imaging capabilities than secondary camera if any
Camera Image SensorRefers to the semiconductor technology of image sensor:  CMOSComplementary MOS circuit
ResolutionA measurement of the maximum size at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) :  4160x3120 pixel
Number of pixels:  13.0 MP cam
Optical ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance:  1 x
Focus:  Contrast Detection Autofocus (CD AF)Contrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
Recordable Image FormatsSupported file formats while capturing photos:  JPG
Auxiliary LightA flash is used to brighten dark areas when taking photographs; is also used as a flashlight:  mobile light (LED)

30 fps
Recordable Video FormatsSupported file formats while capturing videos:  MPEG4
Camera Extra Functions:  Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera, Panorama Photo, HDR photoHigh dynamic range image recording
Camera PlacementRefers to the placement of the primary camera on the device:  Rear

Built-in Secondary Digital CameraWidely used for video telephony or taking selfies
Secondary Camera Sensor:  CMOSComplementary MOS circuit
Secondary Resolution:  2592x1944 pixel
Secondary Number of pixels:  5.0 MP sec. cam
Secondary Recordable Image Formats:  JPG
Secondary Camcorder Resolution:  1280x720 pixel

30 fps
Secondary Recordable Video Formats:  3GP
Secondary Camera Placement:  Front

Power Supply
BatteryBattery technology:  Lithium-ion

Yes
Battery Capacity:  2440 mAh

Ingress Protection

Protection from solid materials:  5 Protected against dust with limited ingress (no harmful deposit)
Protection from liquids:  8 Persistently protected against immersion beyond 1 meter of depth

Built-in Sensors
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis:  Yes
Additional sensorsBuilt-in ambient, biometric and comfort sensors:  Light intensity sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen, Proximity sensorBased on this sensor signal device may control the volume of the voice speaker or dim the display during a call

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